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US 6,671,951 B2Granted
Printed wiring board, and method and apparatus for manufacturing the same
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsToshihiro Nishii, Shigeru Yamane, Shinji Nakamura, Hidenori Hayashi, Toru Fujimoto, Toshiharu Okada, Izuru Nakai
Life of this patent
Estimating the term…
Abstract
In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection means formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.
Claims61
A method of manufacturing a printed wiring board comprising the steps of:
- perforating a through hole or a blind hole by irradiating an amount radiation energy on a substrate in a form of board or sheet composite of either a single or a plurality of materials to form a layer of metamorphic substance at least on an inner wall of said hole with one or more constituent elements of said substrate;
- forming a connection means in the hole formed in said perforation step for electrically connecting an upper and a lower surfaces of the substrate;
- hot-pressing at least two layers of metal foil to sandwich at least said substrate;
- and
- patterning said at least two layers of metal foil,
- wherein layer of metamorphic substance prevents conductive substance constituting said electrical connection means from dispersing or permeating into an interior of the substrate or over a surface thereof.
3 more elements
A method of manufacturing a primed wiring board comprising the steps of:
- perforating a through hole or a blind hole by irradiating an amount radiation energy on a substrate in a form of board or sheet composite of either a single or a plurality of materials;
- forming connection means in the hole formed in said perforation step to electrically connect an upper and a lower surfaces of the substrate;
- hot-pressing at least two layers of metal foil to sandwich at least said substrate;
- and
- patterning said at least two layers of metal foil,
- wherein any one of said perforation step and the succeeding steps further including step of forming a prevention means for preventing conductive substance constituting said electrical connection means from dispersing or permeating into an interior of the substrate or over a surface thereof, and
- wherein a total sum of the radiation energy required for perforating one hole is:
- less than a sum of a minimum amount of energy necessary for perforating the hole in a desired diameter and a minimum amount of energy necessary for forming a layer of metamorphic substance other than carbonized substance on an inner wall of the hole;
- and not more than an amount of energy necessary for forming a layer of carbonized substance on the inner wall of the hole.
6 more elements
A method of manufacturing a printed wiring board comprising the steps of
- perforating a through hole or a blind hole by irradiating an amount radiation enemy on a substrate in a form of board or sheet composite of either a single or a plurality of materials;
- forming a connection means in the hole formed in said perforation step for electrically connecting an upper and a lower surfaces of the substrate;
- hot-pressing at least two layers of metal foil to sandwich at least said substrate;
- and
- pattering said at least two layers of metal foil.
- wherein any one of said perforation step and the succeeding steps further includes a. step of forming a prevention means for preventing conductive substance constituting said electrical connection means from dispersing or permeating into an interior of the substrate or oven surface thereof,
- wherein said radiation energy is obtained by way of a laser beam, and
- wherein a diameter of the laser beam irradiated on the substrate is within 30% and 90% of a designed diameter of the hole.
5 more elements
A method of manufacturing a printed wiring board comprising the steps of:
- perforating a through hole or a blind hole by irradiating an amount radiation energy on a substrate in a form of board or sheet composite of either a single or a plurality of materials;
- forming connection means in the hole formed in said perforation step for electrically connecting an upper and a lower surfaces of the substrate;
- hot-pressing at least two layers of metal foil to sandwich at least said substrate;
- and
- patterning said at least two layers of metal foil,
- wherein any one of said perforation step and the succeeding steps further includes a step of forming a prevention means for preventing conductive substance constituting said electrical connection means from dispersing or permeating into an interior of the substrate or over a surface thereof,
- wherein said radiation energy is obtained by way of a laser beam, and
- wherein a pulse width of the laser beam irradiated on the substrate is a sum of a time necessary for eliminating the substrate material in an irradiated portion, and a time necessary for creating a hole in diameter of 110% to 300% of the laser beam diameter at a surface of the substrate while the hole diameter expands progressively due to en exertion of heat around the eliminated portion of the substrate.
5 more elements
A method of manufacturing a printed wiring board comprising the steps of:
- perforating a through hole or a blind hole by irradiating an amount radiation energy on a substrate in a form of board or sheet composite of either a single or a plurality of materials;
- forming a connection means in the hole formed in said perforation step for electrically connecting an upper and a lower surfaces of the substrate:
- hot-pressing at least two layers of metal foil to sandwich at least said substrate;
- and
- patterning said at least two layers of metal foil,
- wherein any one of said perforation step and the succeeding steps further includes a step of forming a prevention means for preventing conductive substance constituting said electrical connection means from dispersing or permeating into an interior of the substrate or over a surface thereof,
- wherein said radiation energy is obtained by way of a laser beam, and
- wherein a fall time of energy of the laser beam irradiated on the substrate is within 50% and 200% of a time of the half-value width of the peak value.
5 more elements
A method of manufacturing a printed wiring board comprising the steps of:
- perforating a through hole or a blind hole by irradiation an amount radiation enemy on a substrate in a form of board or sheet composite of either a single or a plurality of materials;
- forming a connection means in the hole formed in said perforation step for electrically connecting an upper and a lower surfaces of the substrate:
- hot-pressing at least two layers of metal foil to sandwich at least said substrate;
- and patterning said at least two layers of metal foil,
- wherein any one of said perforation step and the succeeding steps further includes a step of forming a prevention means for preventing conductive substance constituting said electrical connection means from dispersing or permeating into an interior of the substrata or over a surface thereof,
- wherein said radiation energy is obtained by way of a laser beam, and
- wherein a fall time of energy of the laser beam irradiated on the substrate is within 20 μs and 1 ms.
4 more elements
A method of manufacturing a printed wiring board comprising the steps of:
- perforating a through hole or a blind hole by irradiating an amount radiation energy on a substrate in a form of board or sheet composite of either a single or a plurality of materials;
- forming a connection means in the hole formed in said perforation step for electrically connecting an upper and a lower surfaces of the substrate;
- hot-pressing at least two layers of metal foil to sandwich at least said substrate;
- and
- patterning said at least two layers of metal foil,
- wherein any one of said perforation step and the succeeding steps further includes a step of forming a prevention means for prevention conductive substance constituting said electrical connection means from dispersing or permeating into an interior of the substrate or over a surface thereof,
- wherein said radiation energy is obtained by way of a laser beam, and
- wherein energy generated by the laser generation source is cut off with a mask by a maximum of 98%.
5 more elements
A method of manufacturing a printed wiring board comprising the steps of:
- perforating a through hole or a blind hole on a substrate in a form of board or sheet composed of either single or a plurality of materials;
- forming a layer of metamorphic substance at least on an inner wall of said hole with one or more constituent elements of said substrate for preventing conductive materials constituting an electrical connection means from dispersing or permeating into an interior of the substrate material or over a surface thereof;
- forming the electrical connection means in the hole formed in said perforation step;
- for electrically connecting an upper and a lower surfaces of the substrate;
- and
- hot-pressing at least two layers of metal foil to sandwiching at least said substrate.
3 more elements
A method of manufacturing a primed wiring board comprising steps of:
- a) perforating a through hole or a blind hole by irradiating an amount of radiation energy on a substrate in a form of board or sheet composed of either a single or a plurality of materials;
- b) forming an electrical connection means in the formed in said perforation step for electrically connecting an upper and a lower surfaces of the substrate;
- and
- c) hot-pressing at least two layers of metal foil sandwiching at least said substrate,
- wherein one or more components of the material constituting said electrical connection means react or combine with said substrate material to form a dispersion prevention means in vicinity of an inner wall of said hole.
2 more elements
A method of manufacturing a printed wiring board comprising the steps of:
- perforating a through hole or a blind hole by irradiating an amount radiation energy on a substrate in a form of board or sheet composite of either a single or a plurality of materials;
- forming a connection means in the hole formed in said perforation step for electrically connecting an upper and a lower surfaces of the substrate;
- hot-pressing at least two layers of metal foil,
- patterning said at least two layers of metal foil,
- wherein any one of said perforation step and the succeeding steps further includes a step of forming a prevention means for preventing conductive substance constituting said electrical connection means from dispersing or permeating into an interior of the substrate or over a surface thereof,
- wherein said step of in an electrical connection means includes a step of filling conductive paste containing conductive particles in the hole formed in the perforation step, and
- wherein said dispersion prevention means carries voids that allow components other than the conductive particles contained in the conductive paste to pass through, but not allow passage of the conductive particles in a certain extent.
4 more elements
A method of manufacturing a printed wiring board comprising the steps of:
- perforating a through hole or a blind hole by irradiating an amount radiation energy on a substrate in a form of board or sheet composite of either a single or a plurality of material;
- forming a connection means in the hole formed in said perforation step for electrically connecting an upper and a lower surfaces of the substrate;
- hot-pressing at least two layers of metal foil to sandwich at least said substrate;
- and patterning said at least two layers of metal foil,
- wherein any one of said perforation step and the succeeding steps further includes a step of forming a prevention means for preventing conductive substance constituting said electrical connection means from dispersing or permeating into an interior of the substrate or over a surface thereof,
- wherein said step of forming an electrical connection means includes a step of filling conductive paste containing conductive particles in the hole formed in the perforation step, and
- wherein a component ratio of the conductive particles in the conductive paste within the hole increases as a result of the hot-pressing step.
4 more elements
Dependencies are inferred from the claim text.