Method of making an interposer
AssigneeIntel Corporation
InventorMark T. Bohr
Life of this patent
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Abstract
A structure suitable for connecting an integrated circuit to a supporting substrate wherein the structure has thermal expansion characteristics well-matched to the integrated circuit is an interposer. The integrated circuit and the interposer are comprised of bodies that have substantially similar coefficients of thermal expansion. The interposer has a first surface adapted to electrically and mechanically couple to the integrated circuit. The interposer has a second surface adapted to electrically and mechanically couple to a supporting substrate. Electrically conductive vias provide signal pathways between the first surface and the second surface of the interposer. Various circuit elements may be incorporated into the interposer. These circuit elements may be active, passive, or a combination of active and passive elements.
Claims5
A method of making an interposer comprising:
- forming a first set of interconnect lines over a first surface of a substrate;
- forming a second set of interconnect lines over the first surface of the substrate;
- and
- forming vias between the first set of interconnect lines and the second set of interconnect lines, the method further comprising:
- forming a first oxide layer on a first surface of a substrate and a second oxide layer on a second surface of the substrate;
- forming a first silicon nitride layer superjacent to the first oxide layer;
- patterning the first silicon nitride layer to expose portions of the first silicon nitride layer,
- etching the exposed portions of the first silicon nitride layer to form trenches;
- sputtering a copper barrier layer and a copper seed layer over the first surface of the substrate;
- electroplating a conductive material over the copper seed layer;
- forming interconnect lines over the first surface of the substrate;
- and
- depositing a second silicon nitride layer over the first surface of the substrate.
Dependencies are inferred from the claim text.