Low-cost HDMI-D packaging technique for integrating an efficient reconfigurable antenna array with RF MEMS switches and a high impedance surface
AssigneesHRL Laboratories, LLC, Raytheon Company
InventorsDaniel F. Sievenpiper, Adele E. Schmitz, James H. Schaffner, Gregory L. Tangonan, Tsung-Yuan Hsu, Robert Y. Loo, Robert S. Miles
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