Method for fabricating surface acoustic wave filter packages

A method for fabricating plural surface acoustic wave filter chip packages, comprising the steps of:

• providing a wafer and a package substrate, said wafer having plural surface acoustic wave filter chips formed thereon, said package substrate being provided with mounting portions at positions corresponding to the positions of surface acoustic wave filter chips on the wafer;
• forming underfill on the mounting portions of the package substrate;
• mounting the wafer on the package substrate in such a way as to connect the surface acoustic wave filter chips to the mounting portions;
• removing wafer portions between surface acoustic wave filter chips to separate the surface acoustic wave filter chips from each other;
• overlaying a metal shield layer on outer sides of the separated surface acoustic wave filter chips;
• molding a blanket of resin over the metal shield layer covering the surface acoustic wave filter chips;
• and
• dividing the package substrate molded with resin into individual surface acoustic wave filter chip packages.