Back to results
US 6,670,107 B2Granted
Method of reducing defects
AssigneeShipley Company, L.L.C.
InventorJoseph F. Lachowski
Life of this patent
Estimating the term…
Abstract
Disclosed are methods for the reduction of defects during the manufacture of electronic devices. Also disclosed are electronic devices having reduced numbers of defects.
Claims20
A method for reducing the number of defects in an electronic device comprising the steps of:
- first at least partially removing a photoresist from an electronic device, and then contacting the electronic device with a composition consisting essentially of one or more surfactants, water an optionally one or more organic solvents, wherein the amount of surfactant in the composition is less than the critical micelle concentration.
A method of manufacturing an electronic device comprising the steps of:
- first at least partially removing a photoresist layer from a substrate;
- and then contacting the substrate having the partially removed photoresist with a composition consisting essentially of one or more surfactants, water and optionally one or more organic solvents, wherein the amount of surfactant in the composition is less than the critical micelle concentration.
A method of removing photoresist comprising the steps of:
- first contacting a photoresist layer on a subs ate with a composition consisting essentially of one or more surfactants, water and optionally one or more organic solvents wherein the amount of surfactant in the composition is less than the critical micelle concentration;
- and then at least partially removing the photoresist layer.
A method of manufacturing an electronic device comprising the steps of:
- first developing a photoresist on a substrate;
- optionally rinsing the developed photoresist and then contacting the developed photoresist layer with a composition consisting essentially of one or more surfactants, water and optionally one or more organic solvents.
Dependencies are inferred from the claim text.