Back to results
US 6,670,101 B2Granted
Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards
AssigneeDow Global Technologies LLC
InventorsKaoru Ohba, Hideki Akimoto, Philip E. Garrou, Ying-Hung So, Britton Lee Kaliszewski
Life of this patent
Estimating the term…
Abstract
The invention is a process for building-up printed wiring boards using metal foil coated with toughened benzocyclobutene-based dielectric polymers. The invention is also a toughened dielectric polymer comprising benzocyclobutene-based monomers or oligomers, ethylenically unsaturated polymer additive, and, optionally, a photoactive compound.
Claims7
A curable composition comprising:
- a) at least one precursor compound selected from arylcyclobutene monomers, arylcyclobutene oligomers, and combinations thereof;
- and
- b) a polymer or oligomer having a backbone comprising ethylenic unsaturation and terminal acrylate or methacrylate groups.
A photoimageable composition comprising (a) at least one precursor compound selected from arylcyclobutene monomers, arylcyclobutene oligomers, and combinations thereof;
- (b) a polymer or oligomer having a backbone comprising ethylenic unsaturation;
- and (c) a photoactive compound selected from the group consisting of azides, bismaleimides, acrylates, acetylenes, isocyanates, aromatic ketones such as 2,2-dimethoxy-2-phenyl acetophenone, conjugated aromatic ketones, and benzophenone-containing polymers.
Dependencies are inferred from the claim text.