Anisotropic conductive film

Abstract

As an anisotropic conductive film capable of firmly adhering to an electronic component and a circuit board and achieving good electrical continuity by thermal compression bonding at a low temperature at which the circuit board is not deteriorated, an anisotropic conductive film is provided, which has a plurality of conductive paths 2 insulated from each other and penetrating the film substrate 1A in the direction of the thickness of the film substrate, both ends 2a and 2b of each conductive path being exposed to the top and back faces of the film substrate, wherein the film substrate 1A is mainly composed of a polycarbodiimide copolymer having a structure represented by formula (I) below: R3—NCN[Brketopenst][Parenopenst]R2—NCN[Parenclosest]nR2—A[Parenopenst]R1—O—CO—O[Parenclosest]mR1—A—R2[Brketclosest]x[Parenopenst]NCN—R2[Parenclosest]nNCN—R3  (I) wherein m represents an integer of 2-50; n represents an integer of 1-30; x represents an integer of 1-10; A represents a urethane bond; R1 represents an alkylene group; R2 represents an aromatic diisocyanate residue; and R3 represents an aromatic monoisocyanate residue.

Dependencies are inferred from the claim text.