Method for high deposition rate solder electroplating on a microelectronic workpiece

A method for electroplating a tin/lead solder onto a surface of a microelectronic workpiece, comprising:

• exposing the surface of the microelectronic workpiece to a plating solution including a source of tin ions and a source of lead ions;
• placing an electrode in contact with the plating solution;
• and
• applying current between the workpiece and the electrode to electrolytically deposit a tin/lead solder on the surface of the workpiece at a deposition rate of at least 2 microns per minute, wherein current is applied to the workpiece by contacting the surface of the workpiece with a contact assembly that contacts a peripheral edge surface of the workpiece at a plurality of discrete points and applies current thereto.

A method for electroplating a tin/lead solder onto the surface of a microelectronic workpiece, comprising:

• exposing the surface of the workpiece to a plating solution including a source of tin ions and a source of lead ions;
• placing an electrode in contact with the plating solution;
• maintaining the plating solution at a temperature of from 20° C. to 50° C.;
• and
• applying current between the surface of the workpiece and the electrode at a surface current density of from 50 to 200 mA/cm2 to electrolytically deposit tin/lead solder on the surface of the workpiece at a deposition rate of at least 2 microns per minute.

A method for electroplating a tin/lead solder onto a surface of a microelectronic workpiece, comprising:

• exposing the surface of the microelectronic workpiece to a plating solution including a source of tin ions and a source of lead ions;
• placing an electrode in contact with the plating solution;
• and
• applying current between the workpiece and the electrode to electrolytically deposit a tin/lead solder having a lead content of at least 95% at a deposition rate of at least 2 to 8 microns per minute.

A method for electroplating a tin/lead solder onto a surface of a microelectronic workpiece, comprising:

• exposing the surface of the microelectronic workpiece to a plating solution including a source of tin ions and a source of lead ions;
• placing an electrode in contact with the plating solution;
• and
• applying current between the workpiece and the electrode to electrolytically deposit a eutectic tin/lead solder having about 63% tin and 37% lead at a deposition rate of at least 2 to 4 microns per minute.

A method of plating solder on a microelectronic workpiece which method comprises:

• delivering an electroplating solution comprising an aqueous solution including a lead compound as a source of lead ions and a tin compound as a source of tin ions into a reactor chamber adapted to hold a microelectronic workpiece and the solution;
• providing electroplating power by way of a workpiece support in contact with a surface at a side of the workpiece that is to be plated at a large plurality of discrete contact points, while isolating the contact points from exposure to the solution;
• and
• positioning a consumable anode comprised of a metal selected from the group consisting of tin and lead, so as to be spaced from the workpiece support within the reactor chamber for contact with the electroplating solution to achieve the plating of solder on the workpiece.

A method for plating solder on a microelectronic workpiece, which method comprises:

• delivering an aqueous electroplating solution including a concentration of lead ions and a concentration of tin ions to a processing base adapted to hold a microelectronic workpiece and the aqueous electroplating solution;
• mounting the microelectronic workpiece in a moveable head of a moveable actuator into engagement with a contact assembly contacting the workpiece at a large plurality of discrete contact points, in which the moveable head is in a loading position with the microelectronic workpiece removed from the aqueous electroplating solution;
• moving the moveable head from the loading position to a processing position in which a surface of the workpiece that is to be electroplated is brought into contact with the electroplating solution with the side of such surface that is to be processed in a face down orientation, and providing electroplating power to a peripheral edge surface of the side of the workpiece that is to be plated by way of the contact assembly, while sealing the contact points from exposure to the electroplating solution;
• rotating the workpiece in the aqueous electroplating solution;
• and
• positioning a consumable anode in the processing base for contact with the electroplating solution, such anode comprising a metal selected from the group consisting of lead and tin, to achieve the plating of solder on the workpiece.

A method of plating solder on a microelectronic workpiece which method comprises:

• providing electroplating power to the workpiece;
• positioning a consumable anode comprised of a metal selected from the group consisting of tin and lead adjacent to the workpiece;
• and
• delivering an electroplating solution comprising an aqueous solution including a lead compound as a source of lead ions and a tin compound as a source of tin ions into contact with the consumable anode and a surface of a microelectronic workpiece to be plated at a high flow rate sufficient to achieve a solder deposition rate of at least two microns per minute.