Simultaneous provision of controlled height bonding material at a wafer level and associated structures

A method for forming an optical module having at last two dies comprising:

• simultaneously patterning a bonding material over a plurality of first dies;
• aligning a plurality of second dies with the plurality of first dies to form a plurality of first die—second die pairs;
• treating the bonding material to bond the first die—second die pairs;
• and
• separating the bonded first die—second die pairs, each resulting bonded first die—second die pair each containing at least one optical element, wherein each die of the plurality of the first dies has a spacer and said simultaneously patterning includes contacting a transfer wafer having a uniform layer of bonding material thereon with the plurality of first dies and removing the transfer layer, thereby leaving bonding material on the spacers.

A method for forming an optical module having at least two dies comprising:

• simultaneously patterning a bonding material over a plurality of first dies, said simultaneously patterning including providing an adhesive layer as the bonding materal on the plurality of first dies and lithographically patterning using a mask in contact with the adhesive layer;
• aligning a plurality of second dies with the plurality of first dies to form a plurality of first die—second die pairs;
• treating the bonding material to bond the first die—second die pairs, said treating occurring with the mask on the adhesive layer;
• and
• separating the bonded first die—second die pairs, each resulting bonded first die—second die pair each containing at least one optical element.

A method for forming an optical module having at least two dies comprising:

• simultaneously patterning a bonding material over a plurality of first dies, said simultaneously patterning including providing an adhesive layer as the bonding material on the plurality of first dies and lithographically patterning using a mask in contact with the adhesive layer, wherein the mask is a plurality of spacers integrated on a second wafer;
• aligning a plurality of second dies with the plurality of first dies to form a plurality of first die—second die pairs;
• treating the bonding material to bond the first die—second die pairs;
• and
• separating the bonded first die—second die pairs, each resulting bonded first die—second die pair each containing at least one optical element.