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US 6,669,785 B2Granted
Methods and compositions for etch cleaning microelectronic substrates in carbon dioxide
AssigneeMicell Technologies, Inc.
InventorsJames P. DeYoung, Stephen M. Gross, Mark I. Wagner, James B. McClain
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Abstract
A method of cleaning a microelectronic substrate is carried out by providing a cleaning fluid, the cleaning fluid comprising an adduct of hydrogen fluoride with a Lewis base in a carbon dioxide solvent; and then cleaning the substrate by contacting the substrate to the cleaning fluid for a time sufficient to clean the substrate.
Claims8
A method of cleaning a microelectronic substrate, comprising:
- (a) providing a first cleaning fluid, said first cleaning fluid consisting of a single phase solution of an amine and a polar organic cosolvent in carbon dioxide;
- (b) providing a second cleaning fluid, said second cleaning fluid consisting of an adduct of hydrogen fluoride with a Lewis base in carbon dioxide;
- (c) cleaning said substrate by contacting said substrate to said second cleaning fluid for a time sufficient to clean said substrate;
- and
- (d) cleaning said substrate before, after, or both before and after said cleaning step (c) by contacting said substrate to said first cleaning fluid for a time sufficient to clean said substrate.
2 more elements
Dependencies are inferred from the claim text.