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US 6,669,079 B2Granted
Conductive paste and semiconductor component having conductive bumps made from the conductive paste
AssigneeMotorola, Inc.
InventorsLi Li, Treliant Fang
Life of this patent
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Abstract
A conductive paste (16) for use in making conductive bumps (18) and a method for using the conductive paste to make conductive bumps (18) on a substrate (10). The conductive paste (16) is formed by combining a tin alloy with a flux composition containing an aromatic carboxylic acid fluxing agent and a solvent. The conductive paste (16) is disposed on underbump metallization layers (15) and reflowed to form the conductive bumps (18).
Claims7
A method for forming a conductive bump, comprising the steps of:
- providing a substrate having a bond pad disposed thereon;
- disposing a soldering composition over the bond pad, wherein the soldering composition consists essentially of:
- an alloy of tin (Sn);
- a fluxing composition comprising:
- a fluxing agent, wherein the fluxing agent is an aromatic carboxylic acid derivative;
- and
- a polymeric solvent;
- and
- reflowing the soldering composition to form the conductive bump.
6 more elements
Dependencies are inferred from the claim text.