Wire bonding device
AssigneeNEC Electronics Corporation
InventorJun Nogawa
Life of this patent
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Abstract
A wire bonding device in accordance with the present invention is provided, which comprises: an XY table (2), a first holding member (8) supported by the XY table (2), a camera (9) supported by the first holding member (8), a second holding member (5) supported by the XY table (2), a capillary (7) held by the second holding member (5), a stationary base (3) for securing an object of bonding (4) in position, and a driving amount calculating unit (13) for computing the driving amount of the XY table (2) on the basis of the positional deviation of the camera (9) with respect to the origin of the XY table (2) due to temperature change in the first holding member (8) and the positional deviation of the capillary (7) with respect to the origin of the XY table (2) due to temperature change in the second holding member (5).
Claims6
A wire bonding device comprising:
- an XY table;
- a first holding member supported by said XY table;
- a camera supported by said first holding member;
- a second holding member supported by said XY table;
- a capillary held by said second holding member;
- a stationary base for securing an object of bonding in position;
- and
- a driving amount calculating unit for computing the driving amount of said XY table on the basis of the positional deviation of said camera with respect to the origin of said XY table due to temperature change in said first holding member and the positional deviation of said capillary with respect to the origin of said XY table due to temperature change in said second holding member.
Dependencies are inferred from the claim text.