Tape and joint compound dispenser for taping drywall joints

A tape gun for applying joint tape and joint compound to drywall joints comprising:

• a housing having opposed side walls spaced apart a width determined by the width of the tape being applied, and peripheral top, bottom, and end walls;
• said housing defining therein a chamber for holding said joint compound for application to said tape;
• said housing further defining an entrance slot in one end wall opening into said chamber for receiving tape for the application of joint compound thereto and an exit slot for supplying tape with joint compound thereon to the drywall joint;
• said chamber having an upper arcuate top wall and a lower elongated bottom wall;
• a tape lifter swingably mounted in said housing and extending into said chamber between said tape entrance slot and said tape exit slot and positioned adjacent the lower chamber wall with the tape positioned between said lifter and the upper wall of said chamber;
• a handle swingably mounted exteriorly on said housing and operatively connected to said tape lifter for swinging said tape lifter to lift said tape and position said tape against the upper wall of said chamber, and for retracting said lifter to position the same adjacent the bottom wall of said chamber;
• and
• said housing further defining in one wall a valved port through which joint compound is introduced into said chamber below said lifted tape;
• whereby joint compound can be supplied to said chamber through said port and below said tape for subsequent application to said tape as said tape passes through said slots for application to drywall joints.