US 6,668,449 B2 · Method of making a semiconductor device having an opening in a solder mask

Abstract

The present invention features a novel design for a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions of prior art fiducials and pin one indicators. Methods of fabricating a carrier substrate and fabricating a semiconductor device package using the combination pin one indicator and alignment fiducial of the present invention are also provided. Preferably, the pin one indicator/alignment fiducial is placed adjacent a comer area of a ball grid array, and comprises an “L”-shaped narrow opening in a solder mask layer in which two lines, mutually perpendicular to one another, form components of an X-Y axis. The pin one indicator/alignment fiducial of the present invention is configured to provide only a minimal opening in the solder resist, making smaller pitches between solder balls and tighter dimensional controls possible. Therefore, the present invention is particularly useful for packages in which the solder resist surface of the mounting substrate is heavily populated with solder ball contact pads and/or and solder balls, and/or in applications where the chip outline is nearly the same size as the package (e.g., Chip Scale Packages (CSP), Near Chip Size (NCS), etc.).

Claims26

Dependent claims

A process of making a semiconductor device package, comprising:

providing a substrate having a first surface and a second surface, at least one of the first and second surfaces including a plurality of conductors and including at least one semiconductor device attach site;
disposing a solder mask layer on at least part of at least one of the first surface and the second surface of said substrate;
providing an opening in the solder mask layer, said opening in the solder mask layer being a combination pin one indicator and alignment fiducial;
providing at least one semiconductor device;
aligning the at least one semiconductor device to the at least one semiconductor device attach site using said opening in the solder mask layer;
aligning a severing deyice using the combination pin one indicator and alignment fiducial;
and
severing at least a portion of the substrate to obtain at least a portion of said semiconductor device package.

5 more elements

Dependencies are inferred from the claim text.

Method of making a semiconductor device having an opening in a solder mask

Life of this patent

Method of making a semiconductor device having an opening in a solder mask

Life of this patent

Abstract

Claims26