Belt wiper for a chemical mechanical planarization system
AssigneeLam Research Corporation
InventorsTravis R. Taylor, Christian DiPietro, Stephen Jew, Philip Ngoon, Katgenahalli Y. Ramanujam, Tony Luong
Life of this patent
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Abstract
A belt wiper that can be used in a linear belt-type chemical mechanical planarization (CMP) system to maintain a belt pad is provided. The belt wiper mitigates disturbances within a detection region important to a belt pad steering system. Also, the belt wiper mitigates the obscuring of optical components important to operation of an endpoint detection system. Thus, the belt wiper, by wiping the underside of the belt pad will preserve the functionality of both the belt pad steering system and the endpoint detection system.
Claims18
A linear belt-type chemical mechanical planarization (CMP) system, comprising:
- a first drum and a second drum;
- a belt pad having a width, a preparation surface, and an undersurface, the belt pad being disposed around the first drum and the second drum, the belt pad configured to move linearly around the first drum and the second drum, the belt pad further configured to traverse over a wafer preparation location;
- a platen being defined between the first drum and the second drum and inside of the belt pad, the platen providing support at the wafer preparation location;
- and
- a wiper blade disposed between the first drum and the second drum and inside of the belt pad, the wiper blade being configured to extend across width of the belt pad and to be in contact with the undersurface of the belt pad, the wiper blade being capable of removing fluid from the underside of the belt pad.
A belt wiper assembly for use in a chemical mechanical planarization (CMP) system, the CMP system including a linear polishing belt having a preparation surface and an undersurface, comprising:
- a support body disposed within the linear polishing belt;
- a bracket attached to the support body;
- and
- a blade attached to the bracket, the blade configured to contact the undersurface of the linear polishing belt.
A linear belt-type chemical mechanical planarization (CMP) system, comprising:
- a first drum and a second drum;
- a belt pad having a width, a preparation surface, and an undersurface, the belt pad being disposed around the first drum and the second drum, the belt pad configured to move linearly around the first drum and the second drum, the belt pad further configured to traverse over a wafer preparation location;
- a platen being defined between the first drum and the second drum and inside of the belt pad, the platen providing support at the wafer preparation location;
- and
- a wiper blade disposed between the first drum and the second drum and inside of the belt pad, the wiper blade being configured to extend across width of the belt pad and to be in contact with the undersurface of the belt pad, the wiper blade being capable of removing particulate material from the underside of the belt pad.
Dependencies are inferred from the claim text.