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US 6,665,931 B2Granted
Wiring method for forming conductor wire on a substrate board
AssigneeFurukawa Electric Co., Ltd.
InventorsShigeo Yamaguchi, Masaaki Arahori, Toshio Yamamoto, Toshimitsu Nishiwaki
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Abstract
A wiring method is provided, in which a wire conductor is stuck on a surface of a substrate by causing a three-dimensional relative movement between a wiring head for guiding the wire conductor and the substrate such that the wiring head relatively moves along an adhesive layer on the surface of the substrate and the wiring head and the adhesive layer intermittently come close to each other for point contact.
Claims6
A wiring method comprising the steps of:
- (a) forming an adhesive layer on a surface of a substrate;
- (b) providing a three dimension moving mechanism and attaching the mechanism between the substrate and a wiring head so that when the head is operating the mechanism causes a three dimensional motion;
- and
- (c) sticking a wire conductor on the surface of the substrate by causing a three-dimensional relative movement between the substrate and the wiring head adapted to guide the wire conductor such that the wiring head relatively moves along the adhesive layer formed on the surface of the substrate and the wiring head and the adhesive layer intermittently come close to each other for point contact, wherein the three-dimensional relative movement between the wiring head and the substrate executed in said step (c) includes a relative translational motion between the wiring head and the substrate which is performed along the adhesive layer, and a relative reciprocal motion between the wiring head and the substrate which is performed in a direction of thickness of the substrate.
1 more element
Dependencies are inferred from the claim text.