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US 6,665,194 B1Granted
Chip package having connectors on at least two sides
AssigneeInternational Business Machines Corporation
InventorsJanak G. Patel, Dana J. Thygesen
Life of this patent
Estimating the term…
Abstract
A substrate for supporting a semiconductor chip has area array connectors on at least two surfaces to provide a large number of connectors to the chip. At least one contact on one surface is not connected to a contact on the other surface through the substrate. Carriers, such as printed circuit boards are mounted to the two surfaces.
Claims10
An electronic structure, comprising:
- a chip having a first chip contact and a second chip contact;
- a substrate electrically and mechanically connected to said chip, said substrate comprising a first surface for mounting said chip, a second surface different from said first surface, a first electrical conductor extending only from a first location on said first surface to a second location on said first surface through said substrate, and a second electrical conductor extending from said first surface to said second surface through said substrate, said substrate further comprising a first substrate contact at the second location on said first surface and a second substrate contact on said second surface, wherein said first chip contact at the first location is electrically connected to said first substrate contact at the second location by said first electrical conductor and said second chip contact is electrically connected to said second substrate contact by said second electrical conductor, and further wherein said first electrical conductor is electrically isolated from said second electrical conductor;
- and
- a first printed circuit board connected to said first substrate contact and a second printed circuit board connected to said second substrate contact.
1 more element
A method of fabricating an electronic assembly comprising the steps of:
- a. mounting a semiconductor chip to a substrate, said chip having a first chip contact and a second chip contact, said substrate comprising a first surface, a second surface different from said fist surface, a first electrical conductor extending only from a first location on said first surface to a second location on said first surface through said substrate, and a second electrical conductor extending from said first surface to said second surface through said substrate, said substrate further comprising a first substrate contact at the second location on said first surface electrically connected to said first electrical conductor and a second substrate contact on said second surface electrically connected to said second electrical conductor, wherein said first electrical conductor is electrically isolated from said second electrical conductor;
- b. connecting said first chip contact at the first location to said first electrical conductor and connecting said second chip contact to said second electrical conductor;
- and
- c. connecting a first printed circuit board to said first substrate contact and a second printed circuit board to said second substrate contact.
1 more element
Dependencies are inferred from the claim text.