Thermally enhanced lid for multichip modules
AssigneeInternational Business Machines Corporation
InventorsDavid J. Alcoe, William L. Brodsky, Varaprasad V. Calmidi, Sanjeev B. Sathe, Randall J. Stutzman
Life of this patent
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Abstract
An electronic package having one or more components comprising: a substrate having a first coefficient of thermal expansion; a lid attached to the substrate, the lid including a vapor chamber, the lid having a second coefficient of thermal expansion, the first coefficient of thermal expansion matched to the second coefficient of expansion; a thermal transfer medium in contact with a back surface of each component and an outer surface of a lower wall of the lid; and each component electrically connected to a top surface of the substrate.
Claims18
An electronic package having one or more components, said package comprising:
- a substrate having a first coefficient of thermal expansion;
- a lid attached to said substrate, said lid including a vapor chamber, said lid having a second coefficient of thermal expansion, said first coefficient of thermal expansion about equal to said second coefficient of expansion;
- a solid thermal transfer medium in direct contact with a back surface of each component and an outer surface of a lower wall of said lid;
- and
- each component in direct contact with and electrically connected to a top surface of said substrate;
- wherein said lower wall of said lid has protruding regions maintaining contact with said thermal transfer medium on a component of said one or more components.
An electronic package having one or more components, said package comprising:
- a substrate having a first coefficient of thermal expansion;
- a lid attached to said substrate, said lid including a vapor chamber, said lid having a second coefficient of thermal expansion, said first coefficient of thermal expansion between about 25% to about 700% of said second coefficient of expansion;
- a thermal transfer medium in direct contact with a back surface of each component and an outer surface of a lower wall of said lid;
- each component in direct contact with and electrically connected to a top surface of said substrate and
- one or more supports within said vapor chamber between an upper wall of said vapor chamber and said lower wall, some or all of said supports aligned over some or all of said components.
An electronic package, comprising:
- one or more components;
- a substrate having a first coefficient of thermal expansion;
- a lid attached to said substrate, said lid including a vapor chamber, said lid having a second coefficient of thermal expansion, said first coefficient of thermal expansion about equal to said second coefficient of expansion;
- a solid thermal transfer medium in direct contact with a back surface of each component and an outer surface of a lower wall of said lid;
- one or more supports within said vapor chamber between an upper wall of said vapor chamber and said lower wall, some or all of said supports aligned over some or all of said components;
- and
- each component in direct contact with and electrically connected to a top surface of said substrate.
Dependencies are inferred from the claim text.