Cavity design printed circuit board for a temperature compensated crystal oscillator and a temperature compensated crystal oscillator employing the same

A printed wiring board supporting at least one oscillator component, comprising:

• an electrically insulating base layer having first and second major surfaces;
• an electrically insulating top layer having first and second major surfaces an aperture extending through said top layer generally normal to said first and second major surfaces;
• said at least one oscillator component supported upon said first major surface of said base and accessible through said top layer aperture;
• electrical wiring electrically coupling said at least one oscillator component to said top layer first major surface;
• and
• resonator package electrical coupling and mounting pads formed on said top layer first major surface capable of operatively electrically connecting a resonator package to said at least one oscillator component.

An array of at least two frequency controlled oscillators suitable for automated testing as a single unit:

• a circuit board having a top and a bottom and electrical connections for connecting said array of at least two frequency controlled oscillators to a test connector that is operative to couple to a testing computer, wherein individual ones of said array of at least two frequency controlled oscillators further comprise:
• a cavity within said circuit board;
• a component mounting pad located within said cavity between said circuit board top and said circuit board bottom;
• a frequency control component adjacent said cavity and forming an enclosure therewith;
• and
• an electronic oscillator component within said enclosure.

A printed circuit oscillator wiring array for use in the production of frequency controlled oscillators, comprising a circuit board having a top and a bottom and electrical connections for connecting an array of at least two frequency controlled oscillators to a test connector that is operative to couple to a testing computer;

• and wherein individual oscillator wiring circuits within said printed circuit oscillator wiring array further comprise:
• a cavity within said circuit board;
• a component mounting pad located within said cavity between said circuit board top and said circuit board bottom;
• and
• an electronic oscillator component mounted adjacent said component mounting pad within said cavity.

A method for manufacturing a crystal regulated oscillator comprising the steps of:

• providing a base layer wiring substrate having a top and a bottom surface;
• patterning electrically conductive traces on said base-layer wiring substrate
• providing a cavity-layer substrate having a plurality of openings defined therein;
• patterning electrically conductive traces including test connectors on said cavity-substrate;
• laminating together said base-layer wiring substrate and said cavity-layer substrate to form a laminated, electrically interconnected wiring substrate, said cavity-layer and said base-layer together defining a plurality of cavities at said plurality of openings;
• populating said cavities with electronic components;
• providing a plurality of packaged frequency control components;
• enclosing said cavities with said frequency control components to produce a plurality of crystal regulated oscillators;
• and
• singulating said plurality of crystal regulated oscillators from a balance of said laminated substrate.

A method for manufacturing a crystal regulated oscillator comprising the steps of:

• providing a base layer wiring substrate having a top and a bottom surface;
• patterning electrically conductive traces on said base-layer wiring substrate
• providing a cavity-layer substrate having a plurality of openings defined therein;
• patterning electrically conductive traces including test connectors on said cavity-substrate;
• laminating together said base-layer wiring substrate and said cavity-layer substrate to form a laminated, electrically interconnected wiring substrate, said cavity-layer and said base-layer together defining a plurality of cavities at said plurality of openings;
• populating said cavities with electronic components including an integrated circuit die having a frequency adjuster subcircuit and a digital memory, said digital memory being operably linked to said test connectors;
• providing a plurality of packaged frequency control components;
• enclosing said cavities with said frequency control components to produce a plurality of crystal regulated oscillators, each frequency control component being operably linked to said frequency adjuster subcircuit;
• determining temperature compensating frequency adjustment parameters for each one of said plurality of crystal regulated oscillators;
• storing said parameters in said memory for each one of said plurality of crystal regulated oscillators;
• and
• singulating said plurality of crystal regulated oscillators from a balance of said laminated substrate.