Dielectric barrier discharge apparatus and process for treating a substrate

An apparatus comprising:

• a first planar electrode;
• a dielectric layer disposed on a surface of the first planar electrode;
• a second planar electrode spaced above and in a parallel plane with the dielectric layer, wherein the second planar electrode comprises a porous structure;
• a substrate spaced above in a parallel plane with the second planar electrode and at a distance less than or equal to about 10 millimeters from the second planar electrode;
• and
• a power supply in electrical communication with the first electrode and the second electrode.

A process for treating a substrate, the process comprising:

• introducing a substrate to be treated into a chamber, wherein the chamber comprises a dielectric barrier discharge apparatus comprising a first planar electrode, a dielectric layer disposed on the first planar electrode, a second planar electrode spaced above and in a parallel plane with the dielectric layer, and a power supply in electrical communication with the first and second planar electrodes, wherein the second planar electrode is porous and has a geometric transmission factor greater than about 70 percent, and wherein introducing the substrate comprises positioning the substrate above the second planar electrode in a parallel plane and at a distance less than or equal to about 10 millimeters from the second planar electrode;
• flowing an oxygen containing fluid between the first and second electrodes at about an atmospheric pressure;
• pulsing the power supply to the electrodes and generating a plasma comprising reactive species between the first planar electrode and the second planar electrode;
• and
• reacting the reactive species with the substrate.