Semiconductor device and method for manufacturing the same
AssigneeSeiko Epson Corporation
InventorYoshiaki Emoto
Life of this patent
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Abstract
In a stacked package in which semiconductor chips are stacked in layers, in order to mount the semiconductor chips without damaging the semiconductor chips even when an upper semiconductor chip has a greater size, a first chip 12 is mounted on an interposer substrate 11. A second chip 13 having a larger size than that of the first chip 12 is mounted on the rear surface of the first chip 12. The second chip 13 is wire-bonded with respect to the interposer substrate 11 by wires 15. A base member 17 is disposed outside the first chip 12. The first chip 12, the second chip 13 and the base member 17 are molded by a sealing resin 16. Solder balls 18 are provided on the opposite side of the chip-mounting side of the interposer substrate 11.
Claims17
A semiconductor device comprising:
- a first semiconductor chip mounted on a substrate;
- a second semiconductor chip directly mounted on the first semiconductor chip with an adhesive, the second semiconductor chip extending beyond a perimeter of the first semiconductor chip;
- and
- a base member disposed between the second semiconductor chip and the substrate, said base member being laterally spaced apart from the first semiconductor chip;
- wherein the second semiconductor chip is supported by the base member.
A semiconductor device comprising:
- a first semiconductor chip mounted on a substrate;
- a second semiconductor chip directly mounted on the first semiconductor chip with an adhesive, the second semiconductor chip extending beyond a perimeter of the first semiconductor chip;
- and
- a non-compliant filler layer provided between the second semiconductor chip and the substrate;
- wherein the second semiconductor chip is supported by the filler layer.
Dependencies are inferred from the claim text.