Semiconductor device
AssigneeNEC Compound Semiconductor Devices, Ltd.
InventorJunko Kohno
Life of this patent
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Abstract
A semiconductor apparatus comprising: a semiconductor substrate; a first surface of the semiconductor substrate on which a semiconductor device is formed; a second surface opposite to the first surface of the semiconductor substrate; a via hole penetrating through the semiconductor substrate from the first surface to second surface; an electrode, provided on the second surface, connecting to the via hole; wherein the electrode having a barrier layer for preventing any diffusion of a soldering material into the via hole.
Claims18
A semiconductor apparatus comprising:
- a semiconductor substrate;
- a first surface of said semiconductor substrate on which a semiconductor device is formed;
- a second surface opposite to said first surface of said semiconductor substrate;
- a via hole penetrating through said semiconductor substrate from said first surface to second surface;
- an electrode, provided on said second surface, connecting to said via hole;
- wherein said electrode having a barrier layer for preventing any diffusion of a soldering material into said via hole.
A semiconductor apparatus comprising:
- a semiconductor substrate;
- a first surface of said semiconductor substrate on which an FET is formed;
- a second surface opposite to said first surface of said semiconductor substrate;
- a via hole penetrating through said semiconductor substrate from said first surface to second surface and connecting to a source electrode of said FET;
- an electrode, provided on said second surface, connecting to said via hole;
- wherein said electrode having a barrier layer for preventing any diffusion of a soldering material into said via hole.
A semiconductor apparatus comprising:
- a semiconductor substrate;
- a first surface of said semiconductor substrate on which a semiconductor device is formed;
- a second surface opposite to said first surface of said semiconductor substrate;
- a plated heat sink provided on said second surface;
- a barrier layer, provided on a surface of said plated heat sink, for preventing any diffusion of a soldering material into said plated heat sink.
Dependencies are inferred from the claim text.