Back to results
US 6,664,629 B2Granted
Semiconductor device
AssigneeKabushiki Kaisha Toyota Jidoshokki
InventorKazuhiro Maeno
Life of this patent
Estimating the term…
Abstract
A plurality of semiconductor elements are arranged on the top surface of a heat conductive base plate. A resin case is attached to the heat conductive base plate so as to encompass the plurality of semiconductor elements. A metal member including a bridge electrode is incorporated into the resin case. The bridge electrode is electrically connected to a corresponding semiconductor area through bonding wire. An external terminal is incorporated into the bridge electrode.
Claims6
A semiconductor device, comprising:
- semiconductor elements;
- a case mounted so as to encompass said semiconductor elements;
- and
- an electrode, incorporated into said case, for a main current of said semiconductor elements, wherein
- when said case is fixed to a predetermined position relative to said semiconductor elements, said electrode is mounted to bridge an area in which said semiconductor elements are provided.
2 more elements
A semiconductor device, comprising:
- a base plate;
- semiconductor elements provided on said base plate;
- a case mounted so as to encompass said semiconductor elements;
- and
- an electrode, incorporated into said case, for a main current of said semiconductor elements,
- wherein
- said electrode bridges over a circuit including said semiconductor elements.
4 more elements
Dependencies are inferred from the claim text.