Semiconductor device and method of manufacturing the same

A semiconductor device comprising:

• a wafer having at least two chips, each of said at least two chips having
• a support substrate in which at least one concave portion is formed, and
• a metal film formed on said support substrate in a region of the concave portion, said metal film including an inside circumferential portion coincident with an edge of the concave portion and an outside circumferential portion,
• wherein said outside circumferential portion of said metal film is extended to an end of the support substrate, and
• respective metal films extended to ends of respective support substrates of said at least two chips are connected with each other through a region between said chips.

A recording head of a thermal inkjet printer comprising:

• a chip having a support substrate in which at least one concave portion is formed as an ink supply hole;
• and
• a metal film formed on said support substrate in a region including an inside circumferential portion coincident with an edge of the concave portion and an outside circumferential portion, and
• wherein said outside circumferential portion of said metal film is extended to an end of said support substrate.

A recording head of a thermal inkjet printer comprising:

• a wafer having at least two chips, each of said at least two chips having
• a support substrate in which at least one concave portion is formed as an ink supply hole, and
• a metal film formed on said support substrate in a region of the concave portion, said metal film including an inside circumferential portion coincident with an edge of the concave portion and an outside circumferential portion,
• wherein said outside circumferential portion of said metal film is extended to an end of the support substrate, and
• respective metal films extended to ends of respective support substrates of said at least two chips are connected with each other through a region between said chips.