Mounting structure of a semiconductor device
AssigneeFujitsu Limited
InventorAkiomi Hiruma
Life of this patent
Estimating the term…
Abstract
A semiconductor device comprises a substrate, a mounting chip, multi-stage bumps, and a sheet-like interposer member. The mounting chip is bonded to the substrate. The multi-stage bumps have two or more stages of bumps stacked and bonded so that the substrate and the mounting chip are electrically connected by the multi-stage bumps. The interposer member is of a resin material and provided in the stacked stages of the multi-stage bumps. The interposer member has openings each formed between two diagonally arrayed bumps of the multi-stage bumps.
Claims11
A semiconductor device comprising:
- a substrate;
- a mounting chip bonded to the substrate;
- multi-stage bumps having two or more stages of bumps stacked and bonded so that the substrate and the mounting chip are electrically connected by the multi-stage bumps;
- and
- a sheet-like interposer member of a resin material provided in the stacked stages of the multi-stage bumps and having openings each formed between two diagonally arrayed bumps of the multi-stage bumps.
A semiconductor device comprising:
- a substrate;
- a mounting chip bonded to the substrate;
- multi-stage bumps having two or more stages of bumps stacked and bonded so that the substrate and the mounting chip are electrically connected by the multi-stage bumps;
- and
- a sheet-like interposer member of a resin material provided in the stacked stages of the multi-stage bumps and having openings each formed between two diagonally arrayed bumps of the multi-stage bumps, the interposer member having joint portions each interconnecting two adjacent bumps of the multi-stage bumps.
A sheet-like interposer member for use in a semiconductor device including a substrate, a mounting chip bonded to the substrate, and multi-stage bumps having two or more stages of bumps stacked and bonded so that the substrate and the mounting chip are electrically connected by the multi-stage bumps, the interposer member being of a resin material and provided in the stacked stages of the multi-stage bumps and having openings each formed between two diagonally arrayed bumps of the multi-stage bumps.
A semiconductor device comprising:
- a ball-grid-array package;
- multi-stage bumps having two or more stages of bumps stacked and bonded so that the ball-grid-array package and an external integrated-circuit board are electrically connected by the multi-stage bumps;
- and
- a sheet-like interposer member of a resin material provided in the stacked stages of the multi-stage bumps and having openings each formed between two diagonally arrayed bumps of the multi-stage bumps.
Dependencies are inferred from the claim text.