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US 6,664,621 B2Granted
Semiconductor chip package with interconnect structure
AssigneeTessera, Inc.
InventorsJohn W. Smith, Belgacem Haba
Life of this patent
Estimating the term…
Abstract
An active microelectronic element such as a semiconductor chip or wafer is bonded to an interconnect element having substantially the same coefficient of thermal expansion as the active element using small, rigid bonds, desirably made by a solid-phase bonding technique, which accommodate numerous closely-spaced interconnections. The assembly is provided with terminals movable with respect to the active element and interconnect element. The interconnect element desirably provides low-impedance conductive paths interconnecting active electronic devices within the active element.
Claims20
A microelectronic assembly comprising:
- (a) an active microelectronic element having an active element body with surfaces including a front surface, one or more active electronic devices in said body and active element contacts exposed to said front surface;
- and
- (b) an interconnect element having an interconnect element body formed separately from said active element body, said interconnect element body having a coefficient of thermal expansion substantially matched to the coefficient of thermal expansion of said active element body, said interconnect element having surfaces including a first surface confronting said front surface of said active element body, said interconnect element having interconnect conductors carried by said interconnect element body, at least some of said interconnect conductors being connected to at least some of said active element contacts;
- and
- (c) terminals for connection to an external substrate, at least some of said terminals overlying one or more of said surfaces of said interconnect element body, said active element body, or both, said terminals being connected to at least some of said interconnect conductors and movable with respect to said interconnect element body and said active element body.
2 more elements
Dependencies are inferred from the claim text.