US 6,664,618 B2 · Tape carrier package having stacked semiconductor elements, and short and long leads

Abstract

A tape carrier in which a plurality of semiconductor elements can be mounted. The tape carrier includes a base tape on which device holes are formed and a plurality of leads provided on the base tape, wherein inner lead portions, which extend from the periphery of the device hole toward the center of the device hole, are of different lengths.

Drawings

Drawings are temporarily unavailable. Open the PDF at USPTO

Drawings

Claims15

Dependent claims

A semiconductor package comprising:

a tape carrier comprising a flexible base film;
a first semiconductor element having a surface and a first electrode, on which surface the first electrode is provided;
a longer lead which is provided on the tape carrier and connected to the first electrode, said longer lead being essentially parallel to the surface over essentially an enter length of said longer lead, so as to be essentially free of bends;
a second semiconductor element having a surface and a second electrode, on which surface the second electrode is provided, and the first semiconductor element is stacked;
a shorter lead which is provided on the tape carrier and connected to the second electrode and is shorter than the longer lead;
and
a resin material which seals the first semiconductor element, the second semiconductor element, the longer lead and the shorter lead.

4 more elements

Dependencies are inferred from the claim text.

Description14,250 words

Summary2,296 words

#1. Field of the Invention

#The present invention relates to a tape carrier package (TCP) which is a thin semiconductor device, a fabrication method thereof, and a tape carrier.

#2. Description of the Related Art

Brief description of the drawings28 figures

#FIG. 1A is a plan view of a TCP of a first embodiment of the present invention.

#FIG. 1B is a sectional view taken along line C-C′ of FIG. 1A.

#FIG. 2A is a plan view of a TCP of a second embodiment of the present invention.

Detailed description11,532 words

#Hereinafter, embodiments of the present invention will be described with reference to the drawings.

#First Embodiment

#FIGS. 1A and 1B illustrate a first embodiment of the present invention. FIG. 1A is a plan view showing a TCP of the first embodiment of the present invention and FIG. 1B is a sectional view of FIG. 1A taken along line C-C′.

Facts

Application

10/125,444Filed 19 Apr 2002

Priority

JP 2001-14611116 May 2001

Published

US 2002/0171130 A121 Nov 2002

Granted

16 Dec 2003

Term ended

19 Apr 2022

Estimated · how

20 years from earliest known nonprovisional domestic filing plus recorded patent term adjustment. Maintenance-fee lapses, terminal disclaimers and statutory extensions have not been checked. The continuity chain may be incomplete; this is not an enforceability determination.

Classification13 codes

H10W 72/701
Interconnections or connectors in packages: tape-automated bond [TAB] connectors
H10W 70/453
Leadframes: comprising flexible metallic tapes
H10W 90/811
Package configurations: multiple chips on leadframes
H10W 72/07251
Of bump connectors: characterised by changes in properties of the bump connectors during connecting

Timeline

16 May 2001Priority claimedJP 2001-146111
19 Apr 2002Application filedUS 10/125,444
19 Apr 2002Assigned to Oki Electric Industry Co, Ltd.assignment of assignor's interest
21 Nov 2002PublishedUS 2002/0171130 A1
16 Dec 2003GrantedUS 6,664,618 B2
11 Dec 2008Assigned to Oki Semiconductor Co., Ltd.change of name
21 Mar 2014Assigned to Lapis Semiconductor Co., Ltd.change of name
19 Apr 2022Term endedEstimated

Tape carrier package having stacked semiconductor elements, and short and long leads

Life of this patent

Tape carrier package having stacked semiconductor elements, and short and long leads

Life of this patent

Life of this patent

Abstract

Drawings

Drawings

Claims15

Description14,250 words

Drawings

Classification13 codes

Life of this patent

Description14,250 words