Semiconductor package

A semiconductor package comprising:

• a metallic foil having a front surface and a rear surface, the foil being formed to have a recess portion including a bottom and an extended border region around the recess portion;
• a substrate attached to the front surface of the foil over the border region to provide a support for electrical connection of a semiconductor element, the substrate having an opening exposing the recess portion;
• and
• a stiffener formed on the rear surface of the foil for enhancing the rigidity of the foil, the stiffener extending over the border region and around the recess portion;
• wherein the rear surface of the bottom of the recess portion is exposed for heat dissipation, and a semiconductor element is mounted on the bottom of and within the recess portion;
• and
• wherein the stiffener includes a plurality of conductive vias extending through it.

A semiconductor package comprising:

• a metallic foil having a front surface and a rear surface, the foil being formed to have a recess portion including a bottom and an extended border region around the recess portion;
• a substrate attached to the front surface of the foil over the border region to provide a support for electrical connection of a semiconductor element, the substrate having an opening exposing the recess portion;
• a stiffener formed on the rear surface of the foil for enhancing the rigidity of the foil, the stiffener extending over the border region and around the recess portion;
• wherein the rear surface of the bottom of the recess portion is exposed for heat dissipation, and a semiconductor element is mounted on the bottom of and within the recess portion;
• and
• wherein the stiffener includes a plurality of conductive vias extending through the stiffener, the semiconductor package being stackable with one or more other semiconductor packages to form a multi-layer package arrangement, with the conductive vias enabling grounding and/or thermal conduction between the metallic foils of the packages.