Method and apparatus for lead-frame based grid array IC packaging
AssigneeNational Semiconductor Corporation
InventorsJaime Bayan, Anindya Poddar
Life of this patent
Estimating the term…
Abstract
Integrated circuit (IC) package structures and IC package fabrication techniques are provided. The IC package substrate is formed from a metal sheet that is patterned to form a substrate with pads and leads. These pads and leads are pattered throughout the substrate including at least part of the die mounting area. The die is mounted onto the die mounting area of the lead-frame, and respective bonding terminals on the die are electrically connected to the associated bonding areas on the patterned leads. A protective encapsulant is molded to cover the die, bond wires, and most, if not all, of the patterned substrate. Contacts for external electrical connection are formed onto the bottom of the pads.
Claims22
An integrated circuit package comprising:
- a lead-frame having a die mounting area and a multiplicity of bonding locations, the lead frame being patterned to form a plurality of leads and contact pads, wherein at least some of the contact pads are formed within the die mounting area;
- a die having a multiplicity of I/O pads, wherein the die is carried by the die mounting area of the lead frame;
- a plurality of electrically conductive connections connecting the respective I/O pads on said die to bonding locations on the lead-frame;
- an encapsulant that covers the die and at least a portion of the lead-frame, wherein at least a portion of the lead-frame is left exposed, the exposed lead-frame including at least one exposed contact pad.
A lead frame for use in an integrated circuit package, the lead frame comprising a multiplicity of leads, wherein at least a plurality of the leads have contact pads integrally formed therewith that are suitable for forming exposed external contacts, the contact pads having a larger width or diameter than an immediately adjacent portion of the associated leads, the lead frame further including a die mounting area wherein at least one of the contact pads is positioned within the die mounting area.
A method to make a lead-frame suitable for semiconductor packaging comprising the steps of:
- patterning an electrically conductive sheet, the patterning forms at least one device region having leads and contact pads, the device region further having a die mounting area, wherein the die mounting area includes at least one contact pad.
A packaged semiconductor device comprising:
- a conductive lead-frame having a die mounting area, the lead frame being patterned to form a plurality of leads and a plurality of contact pads, wherein at least some of the contact pads are formed within the die mounting area;
- a die having a multiplicity of I/O pads, wherein the die is carried by the die mounting area of the lead frame;
- a plurality of conductors arranged to electrically connect the respective I/O pads on said die to associated leads in the lead-frame;
- an encapsulant that covers the die and at least a portion of the lead-frame, wherein at least the contact pad portions of the lead-frame are left exposed.
A panel assembly suitable for use in an integrated circuit packaging, the panel assembly comprising:
- a lead frame panel patterned to define at least one two dimensional array of substantially immediately adjacent device areas, wherein each device areas includes a plurality of leads and a plurality of contact pads;
- a plurality of dice, each die being mounted on an associated device area, the die being mounted over at least some of the contact pads and electrically connected to associated leads in the associated device area;
- and
- at least one encapsulant cap that covers an associated two dimensional array of immediately adjacent device areas while leaving the contact pads exposed, whereby at least some of the exposed lead frame contact pads are located below the dice.
Dependencies are inferred from the claim text.