Lead frame and bottom lead semiconductor package using the lead frame
AssigneeHyundai Microelectronics Co., Ltd.
InventorSun Dong Kim
Life of this patent
Estimating the term…
Abstract
A lead frame includes a pair of guide rails separated at a predetermined space; at least one dam bar for connecting the pair of guide rails; a die paddle for mounting a semiconductor chip between the dam bar; a tie bar for supporting the die paddle; a plurality of leads each consisting of a first lead having a predetermined length extended from the dam bar between the dam bar and the die paddle, a second lead connected electrically to the first lead and formed bent in a first direction, and a third lead connected electrically to the second lead and formed bent in a second direction.
Claims5
A bottom lead semiconductor package comprising:
- a semiconductor chip having a first and a second surfaces, and having a plurality of bonding pads on the first surface;
- a plurality of leads each comprising a first lead having a first and a second surfaces, the first surface of the first lead being attached onto the first surface of the semiconductor chip, a second and a third leads each having a first and a second surfaces extended from a predetermined portion of the first lead, wherein the second lead includes a first portion bent in a first direction from the predetermined portion of the first lead, and a second portion bent in a second direction away from the semiconductor chip, and wherein the third lead includes a first portion bent in a third direction from the predetermined portion of the first lead, and a second portion bent in a fourth direction away from the semiconductor chip, the first and third directions being different from each other;
- connection means for electrically connecting the first leads and the bonding pads;
- and
- a package main body of which a predetermined region including the semiconductor chip, the plurality of leads and the connection means are sealed with the first surface of the second portion of the second leads and the second surface of the second portion of the third leads exposed respectively.
A lead frame comprising:
- a pair of guide rails separated parallel with each other at a predetermined space;
- at least one dam bar for connecting the pair of guide rails;
- a die paddle for mounting a semiconductor chip between the pair of guide rails;
- a tie bar for supporting the die paddle;
- and
- a plurality of leads each comprising
- a first lead bent in a first direction from the dam bar,
- a wire contact portion formed at one side of the first lead and
- a second lead bent in a second direction from the wire contact portion, wherein
- the first and second directions are different from each other, wherein the first lead includes a first portion bent in the first direction, a second portion bent in a third direction, and a third portion bent in a fourth direction, and wherein the second lead includes a first portion bent in the second direction, and a second portion bent in a fifth direction.
Dependencies are inferred from the claim text.