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US 6,664,613 B2Granted
Magnetic shielding for integrated circuits
AssigneeMicron Technology, Inc.
InventorMark Tuttle
Life of this patent
Estimating the term…
Abstract
A method and apparatus which provide one or more electromagnetic shield layers for integrated circuit chips containing electromagnetic circuit elements are disclosed. The shield layers may be in contact with the integrated circuit chip, including magnetic memory structures such as MRAMs, or in a flip-chip carrier, or both. A printed circuit board which supports the chip may also have one or more shield layers.
Claims12
A printed circuit board comprising:
- a support body having a top surface and a bottom surface, said top surface being in contact with a flip-chip carrier, said flip-chip carrier electrically connected to a chip, wherein said chip is in contact with at least one layer of a magnetic field shielding material;
- and
- at least a second layer of a magnetic field shielding material in contact with said support body.
A printed circuit board comprising:
- a support body having a top surface and a bottom surface, said top surface being in contact with a flip-chip carrier, said flip-chip carrier comprising a first magnetic field shielding material layer;
- and
- at least a second layer of a magnetic field shielding material in contact with said support body.
Dependencies are inferred from the claim text.