Components with releasable leads
AssigneeTessera, Inc.
InventorsBelgacem Haba, Konstantine Karavakis
Life of this patent
Estimating the term…
Abstract
A connection component for making connections to a microelectronic element is made by providing leads on a surface of a polymeric layer and etching the polymeric layer to partially detach the leads from the polymeric layer, leaving a portion of each lead releasably connected to the polymeric layer by a small polymeric connecting element which can be broken or peeled away from the lead. Leads in a connecting element may be covered by an insulating jacket applied by a coating process, and the insulating jacket may in turn be covered by a conductive layer so that each lead becomes a miniature coaxial cable. This arrangement provides immunity to interference and facilitates operation at high speeds.
Claims12
A microelectronic assembly comprising:
- (a) a connection component including a support structure, one or more leads attached to said support structure and projecting from said support structure, each said lead having an elongated section spaced from said support structure so that said elongated section is movable with respect to support structure and a jacket of a dielectric material surrounding each said lead over at least a part of the elongated section of that lead;
- and
- (b) a semiconductor chip having contacts thereon, at least some of said contacts on said chip being connected to at least some of said elongated sections of said leads.
Dependencies are inferred from the claim text.