Printed circuit board having solder bridges for electronically connecting conducting pads and method of fabricating solder bridges

A printed circuit board product comprising:

• a dielectric structure core having a first surface;
• first and second conducting pads on the first surface of the dielectric structure core, wherein each conducting pad of the first and second conducting pads has an upper exposed surface, and wherein the first conducting pad has an edge and the second conducting pad has an edge separated from and adjacent to the edge of the first conducting pad, the edges of the first and second conducting pads defining a surface area of the first surface therebetween;
• and
• a solder bridge electrical connection extending between and across the upper exposed surfaces of only the first and second conducting pads, wherein the solder bridge electrical connection has a uniform thickness on the upper exposed surface of each conducting pad, and wherein the solder bridge electrical connection only partially covers the surface area.

A printed circuit board product comprising:

• a dielectric structure core having a first surface;
• first and second conducting pads on the first surface of the dielectric structure core, wherein each conducting pad of the first and second conducting pads extends outward from the dielectric structure core so as to provide a plurality of exposed upstanding edges, and wherein the adjacent exposed upstanding edges define a surface area of the first surface therebetween;
• and
• a solder bridge electrical connection extending between and connecting adjacent exposed upstanding edges of the plurality of exposed upstanding edges of only the first and second conducting pads, and wherein the solder bridge electrical connection only partially covers the surface area.