Singulation methods and substrates for use with same

A circuit board substrate assembly comprising:

• a substrate material having a length defined along a longitudinal axis;
• a plurality of rows of circuit forming regions of the substrate material aligned parallel to the longitudinal axis;
• one or more circuits formed in the circuit forming regions resulting in rows of individual circuit portions lying along the length of the substrate material parallel to the longitudinal axis, wherein each individual circuit portion comprises a first end portion and a second end portion, and further wherein each individual circuit portion in a row is separated from each adjacent individual circuit portion in the row by an opening;
• a plurality of interconnection regions extending along the length of the substrate material parallel to the longitudinal axis, wherein the first and second end portions of each individual circuit portion are adjacent to an interconnection region;
• and
• a singulation axis defined along the length of the substrate material within each of the plurality of interconnection regions, wherein each singulation axis is parallel to the longitudinal axis, wherein the opening separating each individual circuit portion in a row from each adjacent circuit portion in the row extends into an interconnection region adjacent the first end portion of the individual circuit portion and intersects with a singulation axis lying within such interconnection region, and further wherein such opening extends into an interconnection region adjacent the second end portion of the individual circuit portion and intersects a singulation axis lying within such interconnection region.

A circuit board substrate assembly comprising:

• a substrate material having a length defined along a longitudinal axis;
• a plurality of rows of circuit forming regions of the substrate material aligned parallel to the longitudinal axis;
• one or more circuits formed in the circuit forming regions resulting in a plurality of rows of individual circuit portions lying along the length of the substrate material parallel to the longitudinal axis, wherein each individual circuit portion in a row is separated from each adjacent individual circuit portion in the row by an opening;
• at least one row of the plurality of rows of individual circuit portions being adjacent a first interconnection region and a second interconnection region, wherein the first interconnection region and the second interconnection region lie along the length of the substrate material parallel to the longitudinal axis, wherein the first interconnection region is located between the at least one row of individual circuit portions and an adjacent row of individual circuit portions, and further wherein the second interconnection region is located between the at least one row of individual circuit portions and another adjacent row of individual circuit portions;
• and
• a first singulation axis and a second singulation axis, wherein the first singulation axis and the second singulation axis lie along the length of the substrate material parallel to the longitudinal axis, wherein the first singulation axis is defined in the first interconnection region, wherein the second singulation axis is defined in the second interconnection region, wherein the opening separating each individual circuit portion of the at least one row from each adjacent circuit portions in the at least one row extends into the first interconnection region and the second interconnection region, and further wherein the opening intersects the first singulation axis and the second singulation axis.

A circuit board substrate assembly comprising:

• a substrate material having first and second opposed edges, the substrate material comprising:
• a plurality of circuit forming regions comprising at least one pair of adjacent circuit forming regions;
• a first interconnection region and a second interconnection region, wherein the first interconnection region extends along the first edge and is located between the first edge and the plurality of circuit forming regions, wherein the second interconnection region extends along the second edge and is located between the second edge and the plurality of circuit forming regions;
• and
• a plurality of openings defined in the substrate material, wherein at least one opening is defined in the substrate material between each pair of adjacent circuit forming regions, wherein the at least one opening extends into at least portions of both the first interconnection region and second interconnection region;
• and
• one or more circuits formed in one or more of the circuit forming regions of the substrate material resulting in a packaged individual circuit in each of the one or more circuit forming regions, wherein each packaged individual circuit is formed in the substrate material adjacent the at least one opening.

A circuit board substrate assembly comprising:

• a substrate material having first and second opposed edges, the substrate material comprising:
• a plurality of circuit forming regions comprising at least one pair of adjacent circuit forming regions;
• a first interconnection region and a second interconnection region, wherein the first interconnection region extends along the first edge and is located between the first edge and the plurality of circuit forming regions, wherein the second interconnection region extends along the second edge and is located between the second edge and the plurality of circuit forming regions;
• and
• a plurality of openings defined in the substrate material, wherein at least one opening is defined in the substrate material between each pair of adjacent circuit forming regions, wherein the at least one opening extends into at least portions of both the first interconnection region and second interconnection region;
• and
• one or more circuits formed in one or more of the circuit forming regions of the substrate material resulting in a packaged individual circuit in each of the one or more circuit forming regions, wherein each packaged individual circuit is formed in the substrate material adjacent the at least one opening, and further wherein the packaged individual circuits comprise ball grid array configurations.