Phenolic resin composition
AssigneeMitsui Chemicals, Inc.
InventorsHiroaki Narisawa, Masanobu Maeda, Minoru Hattori, Masahiro Kaneko
Life of this patent
Estimating the term…
Abstract
A phenolic resin composition which is stable against an environmental moisture change and, further, excellent in fast curing property, flexibility and heat resistance. The phenolic resin composition contains 70-97% by weight of a phenolic resin and 3-30% by weight of a silicone-based rubber component and has a ratio of an ortho-bonding to a para-bonding at a methylene bonding in the phenolic resin of 2-9.
Claims6
A phenolic resin composition comprising from 3 parts by weight to 20 parts by weight of hexamethylenetetramine based on 100 parts by weight of a mixture containing from 70% by weight to 97% by weight of a phenolic resin and from 3% by weight to 30% by weight of a silicone-based rubber component, wherein said silicone-based rubber component is a compound of from 85% by weight to 99% by weight of an organopolysiloxane having a silanol group at each terminal of a molecule thereof and from 1% by weight to 15% by weight of a crosslinking agent for silanol condensation, wherein said phenolic resin has a ratio (o/p ratio) of an ortho-bonding to a para-bonding at a methylene bonding of from 2 to 9 and wherein said phenolic resin composition has a hygroscopic rate at 25° C. and a 60% relative humidity of 1% by weight/hr or less.
Dependencies are inferred from the claim text.