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US 6,664,307 B2Granted
Low-shrinkage epoxy resin formulation
AssigneeDymax Corporation
InventorsJohn R. Arnold, Nicole M. Langer
Life of this patent
Estimating the term…
Abstract
Low-shrinkage positioning formulations include, in addition to the resin-forming composition, a filler comprised of fibrous and spherical elements, usually of glass, present in a defined ratio and amount. The resin formulation may desirably comprise epoxy resin and a copolymerizable monomer having amide, acrylamide, or hydroxyl functionality, and may advantageously be devoid of any cationic catalyst ingredient.
Claims15
A fluid mixture capable of curing to a substantially nonshrinking and immobile solid mass, comprising:
- about 10 to 50 percent, based upon the weight of said mixture, of a composition capable of reaction to form a solid, resinous matrix;
- and
- conversely, about 90 to 50 percent, based upon the weight of said mixture, of a solid filler comprised of spherical elements and short fibrous elements present in a spherical element:fibrous element weight ratio in the range 0.1 to 6:1, said filler elements being substantially nonreactive to said composition and exhibiting good adhesion to said resinous matrix.
Dependencies are inferred from the claim text.