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US 6,664,176 B2Granted
Method of making pad-rerouting for integrated circuit chips
AssigneeInfineon Technologies AG
InventorsHarry Hedler, Thorsten Meyer, Stefan Ruckmich, Barbara Vasquez
Life of this patent
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Abstract
A method for forming printed re-routing for wafer level packaging, especially chip size packaging. The method includes forming a contact layer on a semiconductor die, printing a conductive redistribution structure on the contact layer, and etching the contact layer of the die by using the conductive redistribution structure as a self-aligning mask.
Claims29
A method for forming printed re-routing for wafer level packaging, the method comprising:
- forming a contact layer on a semiconductor die;
- printing a conductive redistribution structure on the contact layer;
- and,
- etching the contact layer of the die by using the conductive redistribution structure as a self-aligning mask;
- wherein an under bump material (UBM) is deposited onto the contact layer of the die prior to the forming of a conductive redistribution structure on the contact layer of the die.
2 more elements
A method for forming printed re-routing for wafer level packaging, the method comprising:
- forming a contact layer on a semiconductor die;
- printing a conductive redistribution structure on the contact layer;
- and,
- etching the contact layer of the die by using the conductive redistribution structure as a self-aligning mask;
- and
- forming a passivation layer having a contact pad;
- wherein the forming of the contact layer includes realizing semiconductor defining processes on the contact layer of the semiconductor die and wherein realizing semiconductor structure defining processes comprises forming the passivation layer on the contact layer of the die.
4 more elements
Dependencies are inferred from the claim text.