Hardmask gate patterning technique for all transistors using spacer gate approach for critical dimension control
AssigneeIntel Corporation
InventorsBrian Doyle, Mark Doczy, Pat Stokley
Life of this patent
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Abstract
An electrical element may be made by providing a hardmask unit that has a double gate stack with a first gate layer, a first hardmask layer formed over the first gate layer, a second gate layer formed over the first hardmask layer, and a second hardmask layer formed over the second gate layer. A first spacer for a first element is formed at a location at least partially determined by the presence of the second hardmask layer, and a second structure for a second element is formed at a location at least partially determined by the presence of the first hardmask layer.
Claims44
A method of making electrical elements comprising:
- providing a hardmask unit, the hardmask unit comprising a first gate layer, a first hardmask layer formed over the first gate layer, a second gate layer formed over the first hardmask layer, and a second hardmask layer formed over the second gate layer;
- forming a first spacer for a first element on the hardmask unit, the location of the first spacer being at least partially determined by the presence of the second hardmask layer;
- and
- forming a second structure for a second element on the hardmask unit, the location of the second structure being at least partially determined by the presence of the first hardmask layer.
A method of making electrical elements comprising:
- providing a hardmask unit comprising a first gate layer, a first hardmask layer formed over the first gate layer, a second gate layer formed over the first hardmask layer, and a second hardmask layer formed over the second gate layer;
- forming a first structure on the hardmask unit by removing a portion of the second hardmask layer and the second gate layer from at least a portion of an area adjacent to the first structure, the first structure comprising a section of the second hardmask layer and the second gate layer;
- forming a first spacer for a first element on the hardmask unit by
- removing the second hardmask layer from the first structure,
- applying a spacer material adjacent to a sidewall of the first structure, and
- removing the second gate layer from the first structure;
- removing the first hardmask layer from at least a portion of an area adjacent to the first spacer;
- removing the spacer material from the first spacer;
- forming a second structure for a second element on the hardmask unit by removing a portion of the first hardmask layer;
- removing the first gate layer adjacent to the first spacer;
- and
- removing the first gate layer adjacent to the second structure.
A method of making electrical elements comprising:
- providing a hardmask unit comprising a first gate layer, a first hardmask layer formed over the first gate layer, a second gate layer formed over the first hardmask layer, and a second hardmask layer formed over the second gate layer;
- removing a portion of the second hardmask layer and the second gate layer to form a first structure, the first structure comprising a section of the second hardmask layer and the second gate layer;
- removing the second hardmask layer from the first structure;
- depositing a layer of spacer material on the hardmask unit;
- removing a portion of the layer of spacer material to form a first spacer part adjacent to a sidewall of the first structure;
- removing the second gate layer from the first structure;
- removing the first hardmask layer adjacent to the first spacer part;
- removing the first spacer part to expose a first spacer portion of the first hardmask layer under the first spacer part;
- removing a portion of the first hardmask layer to form a second structure portion of the first hardmask layer;
- removing the first gate layer adjacent to the first spacer portion of the first hardmask layer;
- removing the first gate layer adjacent to the second structure portion of the first hardmask layer;
- removing the first hardmask layer from the first spacer portion to expose a first element, the first element comprising the first gate layer;
- and
- removing the first hardmask layer from the second structure portion to expose a second element, the second element comprising the first gate layer.
Dependencies are inferred from the claim text.