Laser repair operation
AssigneeUnited Microelectronics Corp.
InventorHermen Liu
Life of this patent
Estimating the term…
Abstract
A method of conducting a laser repair operation. A silicon wafer has a plurality of chips thereon. Each chip has a plurality of bonding pads, a plurality of testing pads, a plurality of fuses and a passivation layer for protecting the chip. The passivation layer exposes the bonding pads an the testing pads. A bump-forming process is conducted to form a bottom metallic layer and a bump sequentially over each bonding pad. Only a bottom metallic layer is formed over each testing pad. The bumps are formed, for example, by electroplating or printing. Testing is carried out by probing various bottom metallic layers above the testing pads. Finally, a laser repair is conducted.
Claims4
A laser repair operation, comprising:
- providing a silicon wafer having a plurality of chips therein, wherein each chip has a plurality of bonding pads, a plurality of testing pads, a plurality of fuses an a passivation layer over the chip with the passivation layer having a plurality of openings exposing the bonding pads and the testing pads;
- forming a metallic layer over the wafer;
- removing a portion of the metallic layer so that a first bottom metallic layer is formed over each bonding pad and a second bottom metallic layer is formed over each testing pad;
- coating a plurality of solder materials over the boding pads by printing;
- conducting a reflow operation t transform the plurality of solder materials into a plurality of bumps;
- performing a testing operation by probing a surface of the second bottom metallic layer;
- and
- conducting a laser repair.
Dependencies are inferred from the claim text.