US 6,664,138 B2 · Method for fabricating a circuit device

Abstract

A method for fabricating a circuit device is provided. An insulation resin sheet having the first conductive layer 3 and the second conductive layer 4 adhered to each other by insulation resin 2 is used, the first conductive path layer 5 is formed by the first conductive layer 3, and semiconductor elements 7 are adhered to and fixed on overcoating resin 8 that covers the first conductive path layer 5, thereby freely routing the first conductive path layer 5 having fine patterns below the semiconductor elements 7. Furthermore, the second conductive layer 4 that has been formed to be thick is removed after a package is sealed with a sealing resin layer 13, and external electrodes 14 are formed in through holes of the insulation resin 2.

Claims16

Dependent claims

A method for fabricating a circuit device, comprising:

providing a first conductive layer disposed over a second conductive layer and adhered together by insulation resin;
etching said first conductive layer to form a conductive path layer;
fixing semiconductor elements on said conductive path layer;
coating said conductive path layer and said semiconductor elements with a sealing resin layer;
removing said second conductive layer by etching to expose said insulation resin;
and
providing holes in said insulation resin;
and
forming external electrodes on said conductive path layer through the holes.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application

10/172,419Filed 14 Jun 2002

Priority

JP P. 2001-18542419 Jun 2001

Published

US 2002/0192875 A119 Dec 2002

Granted

16 Dec 2003

Term ends

Not estimatedThe source records don’t support an estimate.

Classification18 codes

H10W 74/117
By a substrate and the encapsulations: the substrate having spherical bumps for external connection
H10P 72/74
For supporting or gripping: using temporarily an auxiliary support
H10W 70/05
Manufacture or treatment: of insulating or insulated package substrates, or of interposers, or of redistribution layers
H10W 74/014
Manufacture or treatment: using batch processing

Method for fabricating a circuit device

Life of this patent

Method for fabricating a circuit device

Life of this patent

Abstract

Claims16