Semiconductor device and manufacturing method thereof

Abstract

A semiconductor device comprises: a semiconductor chip; a copper series lead frame with no residual of a rustproof film, including a die pad mounted with said semiconductor chip, and a plurality of leads disposed so that inner ends of said leads are positioned along the periphery of said die pad; copper wires to directly connect electrodes on said semiconductor chip to the inner ends of said plurality of leads; and a resin molded member to hermetically seal said semiconductor chip, a large proportion of said lead frame and said copper wires, wherein a water soluble rustproof agent is applied over outer lead segments, protruding from said resin molded member, of said plurality of leads. A method of manufacturing a semiconductor device comprises: preparing a copper series lead frame including a die pad and a plurality of leads disposed so that inner ends of said leads are positioned along the periphery of said die pad; applying a non-benzotriazole series rustproof agent over the surface of sad lead frame; executing die-bonding for fixing a semiconductor chip onto said die pad in a heating atmospheric air by use of a non-metal series paste; executing wire-bonding for connecting said electrodes on said semiconductor chip to the inner ends of said leads of said lead frame by use of copper wires; forming a resin molded member by sealing said leads with some portions excluded with a resin; forming leads protruding from said resin molded member; and applying a water soluble rustproof agent over said leads protruded from said resin molded member.

Dependencies are inferred from the claim text.