Method of manufacturing a ball grid array type semiconductor package

A method of manufacturing a semiconductor device comprising the steps of:

• (a) preparing a semiconductor chip having a plurality of semiconductor elements and a row of external terminals on a main surface thereof;
• (b) preparing a wiring substrate comprising a wiring substrate base, a plurality of bump lands, a plurality of anchor wirings, the wiring substrate base having an opening positioned between the plurality of bump lands and the plurality of anchor wirings, and a plurality of leads respectively forming bridge connections between individual ones of the plurality of bump lands and corresponding ones of the plurality of anchor wirings, over the opening,
• wherein a width of each of the anchor wirings in a direction parallel to an edge of the opening is larger than a width of the corresponding lead at the edge of the opening and anchor wirings which are adjacently disposed over the same side of the opening are connected with each other;
• (c) positioning the wiring substrate over the main surface of the semiconductor chip such that the opening is positioned over the row of external terminals;
• and
• (d) cutting the plurality of leads at respective portions thereof over the opening and bonding each of the plurality of leads on corresponding ones of the external terminals through the opening, respectively.