Method of manufacturing multi-layer printed wiring board

A method of manufacturing a multi-layer printed wiring board comprising, sequentially:

• adhering an adhesive uncured resin sheet to at least one surface of an inner base plate, the inner base plate having wiring layers on both of two opposed surfaces;
• irradiating a portion of said uncured resin sheet with a laser beam to form, in said uncured resin sheet, a through hole, exposing a connection portion of said wiring layer of said inner base plate;
• filling the through hole with a conductive material to form an interlayer conductor electrically connecting a front surface and a back surface of said uncured resin sheet to each other;
• adhering a conductive film to a portion of the front surface of said uncured resin sheet containing said interlayer conducter;
• curing said uncured resin sheet;
• and
• patterning said conductive film into a wiring shape.