Metal insulator structure with polarization-compatible buffer layer
AssigneesSymetrix Corporation, Matsushita Electric Industrial Co., Ltd.
InventorsMasamichi Azuma, Carlos A. Paz de Araujo
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AssigneesSymetrix Corporation, Matsushita Electric Industrial Co., Ltd.
InventorsMasamichi Azuma, Carlos A. Paz de Araujo
Estimating the term…
An MIS device (20) includes a semiconducting substrate (22), a silicon nitride buffer layer (24), a ferroelectric metal oxide superlattice material (26), and a noble metal top electrode (28). The layered superlattice material (26) is preferably a strontium bismuth tantalate, strontium bismuth niobate, or strontium bismuth niobium tantalate. The device is constructed according to a preferred method that includes forming the silicon nitride on the semiconducting substrate prior to deposition of the layered superlattice material. The layered superlattice material is preferably deposited using liquid polyoxyalkylated metal organic precursors that spontaneously generate a layered superlattice upon heating of the precursor solution. UV exposure during drying of the precursor liquid imparts a taxis orientation to the final crystal, and results in improved thin-film electrical properties.
A method of making a device for use in integrated circuits, said method comprising the steps of:
Dependencies are inferred from the claim text.