Photosensitive polymide precursor resin composition

A negative photosensitive resin composition which comprises an acid generating compound for generating an acid by light irradiation and at least one polyimide precursor selected from the group consisting of (a) a silicon-containing polyimide precursor obtained from (1) A mols of a derivative of a tetracarboxylic dianhydride formed by reacting 1 or 2 mols of a monovalent saturated alcohol having 1 to 7 carbon atoms with 1 mol of the tetracarboxylic dianhydride, (2) B mols of a diamine and (3) C mols of an aminosilicon compound represented by the formula (1)

• H2N—R1—SiR23−kXk (1)
• wherein R1 is —(CH2)s—,
• s is an integer of from 1 to 4;
• R2 is independently an alkyl group having 1 to 6 carbon atoms, a phenyl group or a phenyl group substituted by an alkyl group having 7 to 12 carbon atoms;
• X is a hydrolytic alkoxy group;
• and k is 1≦k≦3 in a ratio meeting the following formulae (2) and (3) 1 ≤ C A - B ≤ 2.5 ( 2 ) 0.1 ≤ C B + C ≤ 1 , ( 3 )
• (b) a silicon-containing polyamic acid ester obtained by esterifying the precursor (a) with a monovalent saturated alcohol having 1 to 7 carbon atoms, and
• (c) a partially esterified silicon-containing polyamic acid ester obtained by partially esterifying the precursor (a) with the movement saturated alcohol having 1 to 7 carbon atoms,
• wherein the tetracarboxylic dianhydride is represented by the formula (4)
• the diamine is represented by the formula (5)
• H2N—R5—NH2 (5),
• the main chain of the polyimide precursor comprises e mols, f mols, n mols, m mols, h mols, i mols (where each of e, f, n, m, h and i is 0 or a positive integer) of structural units represented by the formula (6), (7), (8), (9), (10) and (11), respectively,
• and e, f, n, m, h and i meet the equation (12) 0 ≦ 100 × m + h + 2 ⁢ i 2 ⁢ ( e + f + n + m + h + i ) < 40 ( 12 )
• wherein each R3 is independently a tetravalent carbocyclic aromatic group, a heterocyclic group, an alicyclic group or an aliphatic group;
• each R5 is independently a divalent aliphatic group having 2 or more carbon atoms, an alicyclic group, an aromatic aliphatic group, a carbocyclic aromatic group, a heterocyclic group or a polysiloxane group;
• R6 is an alkyl group having 1 to 7 carbon atoms;
• and wherein, upon exposure of said composition to light, the acid generating compound generates acid, which causes a silane at the end of at least one polyimide percursor to undergo a siloxane condensation reaction and a subsequent intermolecular cross-linking reaction with another silane.

A negative photosensitive resin composition which comprises an acid generating compound for generating an acid by light irradiation and a silicon-containing polyamic acid ester formed by esterifying a silicon-containing polyimide precursor obtained by reacting A mols of a tetracarboxylic dianhydride, B mols of a diamine and C mols of an aminosilicon compound represented by the formula (1)

• H2N—R1—SiR23−kXk (1)
• wherein R1 is —(CH2)s—,
• s is an integer of from 1 to 4;
• R2 is independently an alkyl group having 1 to 6 carbon atoms, a phenyl group or a phenyl group substituted by an alkyl group having 7 to 12 carbon atoms;
• X is a hydrolytic alkoxy group;
• and k is 1≦k≦3 in a ratio meeting the following formulae (2) and (3) 1 ≤ C A - B ≤ 2.5 ( 2 ) 0.1 ≤ C B + C ≤ 1 ( 3 )
• with a monovalent saturated alcohol having 1 to 7 carbon atoms, wherein, upon exposure of said composition to light, the acid generating compound generates acid, which causes a silane at the end of the silicon-containing polyamic acid ester to undergo a siloxane condensation reaction and a subsequent intermolecular cross-linking reaction with another silane.

A negative photosensitive resin composition which comprises an acid generating compound for generating an acid by light irradiation and a partially esterified silicon-containing polyamic acid ester formed by partially esterifying a silicon-containing polyimide precursor obtained by reacting A mols of a tetracarboxylic dianhydride, B mols of a diamine and C mols of an aminosilicon compound represented by the formula (1)

• H2N—R1—SiR23−kXk (1)
• wherein R1 is —(CH2)s—,
• s is an integer of from 1 to 4;
• R2 is independently an alkyl group having 1 to 6 carbon atoms, a phenyl group or a phenyl group substituted by an alkyl group having 7 to 12 carbon atoms;
• X is a hydrolytic alkoxy group;
• and k is 1≦k≦3 in a ratio meeting the following formulae (2) and (3) 1 ≤ C A - B ≤ 2.5 ( 2 ) 0.1 ≤ C B + C ≤ 1 , ( 3 )
• with a monovalent saturated alcohol having 1 to 7 carbon atoms, wherein, upon exposure of said composition to light, the acid generating compound generates acid, which causes a silane at the end of the silicon-containing partially esterified polyamic acid ester to undergo a siloxane condensation reaction and a subsequent intermolecular cross-linking reaction with another silane.