Hole printing by packing and unpacking using alternating phase-shifting masks
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsBurn-Jeng Lin, Shinn-Sheng Yu, Bang-Chein Ho
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsBurn-Jeng Lin, Shinn-Sheng Yu, Bang-Chein Ho
Estimating the term…
A new method is provided for the creation of contact holes. The DOF and MEF of closely packed holes can be improved using Alternating Phase Shifting Mask (Alt PSM) for the exposure of the holes. However, Alt PSM are dependent on hole density or hole separation and are less effective where holes are relatively further separated from each other. In order to improve DOF and MEF performance for the creation of holes, the invention adds extra holes to a given pattern of contact holes on the surface of a first mask, thus densifying the pattern of holes on the first mask and therefore reducing the range of the hole-diameter to hole separation ratio. The pattern of added holes is alternating in phase with the pattern of desired holes. The added holes will be filled up using a second mask.
A method of creating closely spaced contact holes, comprising the steps of:
A method of creating closely spaced contact holes, comprising the steps of:
A method of creating closely spaced contact holes, comprising the steps of:
A packed mask for creating closely spaced contact holes, comprising:
A packed mask for creating closely spaced contact holes, comprising:
A packed mask for creating closely spaced contact holes, comprising:
A packed mask for creating closely spaced contact holes, comprising:
Dependencies are inferred from the claim text.