Heat dissipating structure
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsKunihiko Mita, Akio Suzuki, Tsutomu Yoneyama
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Abstract
A heat dissipating structure is provided which lowers the thermal contact resistance between a heat generating electronic component and a heat dissipating component, and markedly improves the heat radiation. The heat dissipating structure comprises a graphite sheet and a heat conducting material layer provided on at least one surface of the graphite sheet, and is positioned between the electronic component and the heat dissipating component. The heat conducting material has no fluidity at room temperature when the electronic component is not operating, but undergoes a reduction in viscosity, softens or melts, under the influence of heat generated during operation of the electronic component.
Claims15
A heat dissipating structure for positioning between an electronic component and a heat dissipating component, the heat dissipating structure comprising
- a graphite sheet;
- and
- a layer comprising a heat conducting material provided on at least one surface of said graphite sheet, wherein
- said heating conducting material has no fluidity at room temperature when said electronic component is not operating, but undergoes a reduction in viscosity, softens or melts, under influence of heat generated during operation of said electronic component;
- said heat conducting material comprises
- a silicone resin, which forms a matrix phase, and
- a heat conducting filler;
- and
- said silicone resin comprises T units represented by the formula RSiO3/2 and D units represented by the formula R2SiO, where R stands for a monovalent hydrocarbon group of 1 to 10 carbon atoms, at a ratio of T units to D units ranging from 10:90 to 90:10.
A heat dissipating structure for positioning between an electronic component and a heat dissipating component, the heat dissipating structure comprising
- a graphite sheet;
- and
- a layer consisting of a heat conducting material provided on at least one surface of said graphite sheet, wherein
- said heating conducting material has no fluidity at room temperature when said electronic component is not operating, but undergoes a reduction in viscosity, softens or melts, under influence of heat generated during operation of said electronic component;
- and
- said heat conducting material consists essentially of
- a silicone resin, which forms a matrix phase, and
- a heat conducting filler.
Dependencies are inferred from the claim text.