Packaging material for molding material and parts for semiconductor production apparatuses, method for packaging by using same and packaged molding material and parts for semiconductor production apparatuses

A packaged article with a packaging material enclosing or overlaying said article, wherein said article is a molding material or part for semiconclklclor production apparatuses, and said packaging material has a total amount of gas (excepting steam) generated when heating at 80° C. for 15 minutes of not more than 5 μg/1 g of the packaging material and a total amount of moisture generated when heating at 80° C. for 30 minutes is not more than 13 μg/1 g of the packaging material.

A method for packaging molding materials or parts for semiconductor production apparatuses, which comprises packaging a molding material or part for semiconductor production apparatuses in a packaging material, so that when the molding material or part for semiconductor production apparatuses is sealed in the packaging material. allowed to stand for 24 hours in an environment of 40° C. and 90% RH and then unpacked, the packaged molding material or part for semiconductor production apparatuses has a property that a percentage of an increase in the number of fine particles having a particle size of not less than 0.2 μm and being present on the surface of the molding materials or parts is not more than 150%, that a percentage of an increase in an amount of water generated when heating the molding materials or parts at 300° C. for 30 minutes is not more than 100%, and that a percentage of an increase in a total amount of gas (excepting steam) generated when heating them at 200° C. for 15 minutes is not more than 100%,

• wherein said packaging material has a total amount of gas (excepting steam) generated when heating at 80° C. for 15 minutes of not more than 5 μg/1 g of the packaging material and a total amount of moisture generated when heating at 80° C. for 30 minutes is not more than 13 μg/1 g of the packaging material.