Method for copper plating deposition
AssigneeInteruniversitair Microelektronica Centrum
InventorsRoger Palmans, Yuri Lantasov
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Abstract
The present invention describes a method for copper deposition on a substrate having a barrier layer wherein a substrate (2) and an activator (1) are immersed in a copper plating bath in order to contact each other for a predetermined period.
Claims19
A plating method for copper deposition on a substrate having a barrier layer, the method comprising the steps of:
- immersing the substrate in a copper plating bath;
- immersing an activator comprising a contact metal in said copper plating bath, whereby said contact metal is dissolved in said copper plating bath to yield a reducing agent;
- and
- performing a direct contact between said activator and said substrate for a time period, whereby copper is deposited on said substrate.
A plating method for copper deposition on a substrate having a barrier layer, the method comprising the steps of:
- immersing the substrate in a copper plating bath, wherein said copper plating bath comprises a source of Cu (II) ions, a complexing agent capable of maintaining Cu(II) ions in solution at a pH above 12.0, and an additive capable of adjusting a pH of said bath, and wherein said copper plating bath does not comprise a reducing agent;
- immersing an activator in said copper plating bath;
- and
- performing a direct contact between said activator and said substrate for a time period, whereby copper is deposited on said substrate.
A plating method for copper deposition on a substrate having a barrier layer, the method comprising the steps of:
- immersing the substrate in a copper plating bath;
- immersing an activator in said copper plating bath, wherein the activator has a determined shape, and wherein said determined shape of said activator is a clamping holder;
- and
- performing a direct contact between said activator and said substrate for a time period, whereby copper is deposited on said substrate.
A plating method for copper deposition on a substrate having a barrier layer, the method comprising the steps of:
- immersing the substrate in a copper plating bath;
- immersing an activator in said copper plating bath, wherein the activator has a determined shape, and wherein said determined shape of said activator is a clamping ring;
- and
- performing a direct contact between said activator and said substrate for a time period, whereby copper is deposited on said substrate.
Dependencies are inferred from the claim text.