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US 6,663,819 B2Granted
Conductive plate molding method
AssigneeAraco Kabushiki Kaisha
InventorEiichiro Morozumi
Life of this patent
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Abstract
According to a molding method for a conductive plate of this invention, a substrate having through holes each corresponding to each protruded portion is employed and the substrate is sandwiched between both dies. Then raw powder is filled into each housing portion provided opposing each through hole in the substrate provided in each of both dies, through the through hole in order to form each protruded portion. Then the protruded portion is formed integrally with the substrate by heating the raw powder under pressure.
Claims10
A molding method for molding a conductive plate, comprising the steps of:
- preparing a substrate having through holes;
- preparing a mold having dies, at least one of dies including housing portions each having an opening opposing each through hole in the substrate;
- sandwiching the substrate between both dies of the mold such that each through hole corresponds to each housing portion of the die;
- filling each housing portion with raw powder through each through hole;
- and
- forming a plurality of protruded portions which are protruded at least in one direction of the substrate, by heating the raw powder under pressure.
3 more elements
Dependencies are inferred from the claim text.